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Year 2005

Data Sheet

Shining Wave Metals
Mokume-Gane

MOKUME-GANE

Shining Wave Mokume-gane (Japanese for wood grain) is specially formulated using contemporary metals. The diffusion bonded laminations are designed to provide for bold patterns even without patination. Diamond, Raindrop and Random patterns are twenty-one layers with heavy sterling silver backs. The Ladder pattern is twenty-seven layers and shows on both sides. No solder is used! At 24 ga. each layer is less than .001 inch thick.

COPPER/BRASS Mokume-gane*

COMPOSITION:
50% yellow brass (13 layers), 50% copper by volume (14 layers).

MELTING POINT: 1700°F.

ANNEALING TEMPERATURE:
1300°F for one minute. Do not quench. Pickle in 10% sulfuric acid or Sparex. NOTE: Etching may occur if Mokume is left in the pickle for extended periods.

FABRICATION:
This is a very strong lamination. Forming techniques used on traditional copper alloys may be applied with a greater frequency of annealing. Reductions of greater than 50% between anneals is not recommended.

ETCHING:
Etching will open the surface for patination and provide some dimensional topography. Our "Multi-Etch" used cold provides the best etch. A 10% ferric chloride solution (available in electronic supply stores) either cold or warm will give a very smooth etch. A 25% nitric acid solution will produce a good etch with a somewhat ragged surface. Please follow all safety procedures when using acids.

*Multi Straight Grain & Triple Straight grain have the same overall working characteristics as shown here.

SILVER/COPPER Mokume-gane

COMPOSITION:
64% copper, 36% sterling silver by volume.

Random, Raindrop, Diamond - 21 layers + sterling back

Ladder - 27 layers & patterned on both sides

Flat, Straight - 27 layers

Multi Straight - 37 layers (18 Stg, 16 Cu, 3 Shakudo)

MELTING POINT: 1432°F.

ANNEALING TEMPERATURE:
1250°F for one minute. Do not quench. Pickle in 10% cold sulfuric acid or Sparex.

FABRICATION:
Forming in 16 gauge(.051") and thinner may be pursued with conventional techniques and a slightly greater frequency of annealing. Great care should be used when forming metal 14 gauge(.064") or thicker, with a much greater frequency of annealing cycles. Care should be exercised when soldering this lamination because of its low melting temperature. The use of easy and medium silver solder is recommended.

ETCHING:
Etching will open the surface for patination and provide some dimensional topography to the metal. Our "Multi-Etch" used cold is the absolute best etch. You may also use a 25% nitric acid solution. The silver will remain relatively untouched while the copper will be strongly etched. Take care not to over etch. Ferric chloride and household ammonia which are much safer and slower may also be used. Please follow all safety procedures when using acids.

PATINATION
Baldwin's Patina is the perfect patination solution for these metals. Gently rubbing a small amount on the surface will darken the copper to deep brown and Shakudo to black. The silver will not be affected.

Traditional liver of sulphur can be used as a very dilute solution. Yellow stains on the sterling areas may be difficult to remove selectively. Ammonia or ammonia vapors may also be used to produce a soft brown on the copper.